Semiconductor metrology for FEOL (front end of line) processes
Rigaku provides semiconductor metrology tools that enable optimization of operations performed on semiconductor wafers in the course of device manufacturing up to first metallization. Example applications include:
- SOI engineered substrates
- Strained silicon
- SiGe HBT and BiCMOS structures
- Metal gates
- Ohmic contacts
- Gate dielectrics (ONO, SiON, High k)
- Silicides (WSix, NiSix, CoSix)
Measuring thickness with atomic scale sensitivity, Rigaku X-ray metrology systems deliver critical information on the composition and structure of advanced semiconductor materials at today's technology nodes and beyond. A pioneer and world leader in designing and manufacturing X-ray based measurement tools to solve semiconductor manufacturing challenges, Rigaku has provided over 30 years of global semi metrology leadership.