Stress analyzer

The PSPC may be said to be a linear counter as opposed to the SC and PC which are point counters. While the latter counters obtain diffracted X-rays by scanning over the given angular range for measurement, the former counter performs simultaneous counting over a section of 50 to 100 mm in the longitudinal direction i.e.; approximately 20° in 2θ range. The PSPC has excellent resolving power.

Simultaneous counting of a 20° range, with no need of detector scanning, has substantially reduced the measurement time. Thus allowing rapid measurement. Moreover, the capability of integrated measurement permits detection of exceedingly weak diffracted X-rays from micro areas. Rigaku has incorporated this PSPC detector with its X-ray stress analyzer system to obtain high-speed and micro-area measurement of residual stress.

Rapid stress analyzer: PSPC/MSF

Permits high-speed measurement. Compared with the conventional method, the measurement time can be reduced drastically, 10 to 100 times faster depending upon the kind of measurement. This is a field oriented X-ray stress analyzer that enables the operator to immediately get the ultimate data on the stress value from a simple operation.

• Ultimate data on the stress value is immediately obtainable
• An optimal system for field operation that allows bulk processing of samples to be measured.
• Can cope with any sample shape
• Incorporates various measurement methods such as the iso-inclination method, side-inclination method, etc.
• The condition under measurement can be readily checked on the CRT

Micro stress analyzer: PSPC/MICRO STRESS

The PSPC and a special optical system jointly get precise information on residual stress existing in micro areas as small as 0.15 mm in diameter. Up to now, detection from such extremely small areas has been considered difficult. As such, this system is most suitable for complex figure sample and very small grain size. (carbonized steel, ceramics, etc.)

• Residual stress measurement of micro areas of 0.15 mm dia. and above in a short time
• The system allows immediate data processing upon completion of measurement
• An optimal system for measurement of residual stress in IC packages, those components that underwent ultra-precision machining, shaping on a fabrication, etc.
• The X-ray beam size is selectable between 0.15 mm and 2 mm dia. by using the appropriate incident collimator
• Incorporates various measurement methods such as the iso-inclination method, side-inclination method, etc.
• Easily adaptable to a motor-driven X-Y stage as an option (standard: manual)